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Ships within 48 hours · Estimated delivery Nov 9 - Nov 14
EMCP-BGA-168EMCP-BGA-136EMCP-BGA-529EMMC-BGA-1001x EMMC-UFS NB2 Adapter
Sturdy all-metal pillar stand
length: 40mm
Exynos9610/9611RAM
XZZ TR Middle Frame BGA Plant Tin Platform For iPhone X-17 Pro Max option:X-16PM mid-frame stencil(18pcs) EMCP-BGA-168EMCP-BGA-136EMCP-BGA-529EMMC-BGA-1001x EMMC-UFS NB2 AdapterXZZ TR middle layer reballing platform for iPhone X 11 12 13 14 15 16 17 Pro Max motherboard mid frame soldering repair. XinzhiZao XZZ TR BGA Reballing Stencil with positioning mold and universal base for iPhone X 17 Pro Max motherboard middle frame tin planting repair. Option: 1. XZZ TR Middle layer reballing platform for iPhone X 17 Pro Max. 2. XZZ TR Middle Frame BGA Plant Tin Platform for iPhone X 16 Pro Max 16e. 3. XZZ TR 17 Series mold for
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